Faa'iidooyinka habaynta LMJ
Cilladaha soo jireenka ah ee habka laser caadiga ah waxaa lagaga gudbi karaa isticmaalka caqliga leh ee tignoolajiyada Laser micro jet (LMJ) si loo faafiyo sifooyinka indhaha ee biyaha iyo hawada.Tiknoolajiyadani waxay u oggolaaneysaa garaaca laysarka inay si buuxda uga muuqdaan jet-biyoodka nadiifka sare ee la warshadeeyay si aan dhib lahayn si ay u gaaraan dusha mashiinka sida fiber-ka indhaha.
Tilmaamaha ugu muhiimsan ee tignoolajiyada LMJ waa:
1. Laydhka laysarka waa qaab-dhismeed tiirar ah (barbar socda).
2. Wadnaha laysarka waxaa lagu kala qaadaa jet-biyoodka sida fiber indhaha, iyada oo aan wax faragelin deegaan ah.
3. Laydhka laysarka wuxuu diiradda saarayaa qalabka LMJ, iyo dhererka dusha sare ee mashiinka ma beddelayo inta lagu jiro habka wax-qabadka oo dhan, sidaas darteed uma baahna in la sii wado diiradda isbeddelka qoto-dheer ee farsamaynta inta lagu jiro farsamaynta.
4. Si joogto ah u nadiifi dusha sare.
5. Waxa intaa dheer in ablation ee walxaha workpiece by garaaca laser kasta, waqti kasta halbeeg laga bilaabo bilowga garaaca garaaca garaaca garaaca soo socda, walxaha warshadaysan waa in xaaladda-waqtiga dhabta ah biyaha qaboojinta ilaa 99% wakhtiga. , kaas oo ku dhawaad meesha ka saaraya aagga kuleylka saameeya iyo lakabka remelt, laakiin wuxuu ilaaliyaa waxtarka sare ee habka.
| Tilmaamaha guud | LCSA-100 | LCSA-200 |
| Mugga Countertop | 125 x 200 x 100 | 460×460×300 |
| dhidibka toosan ee XY | Matoorka toosan.Matoorka toosan | Matoorka toosan.Matoorka toosan |
| dhidibka toosan Z | 100 | 300 |
| Meelaynta saxnaanta μm | +/- 5 | +/- 3 |
| Saxnaanta meelaynta soo noqnoqda μm | +/- 2 | +/- 1 |
| Dardargelinta G | 0.5 | 1 |
| Xakamaynta tirada | 3- dhidibka | 3- dhidibka |
| Laser |
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|
| Nooca laser | DPSS Nd: YAG | DPSS Nd: YAG, garaaca wadnaha |
| Mawjada nm | 532/1064 | 532/1064 |
| Awood la qiimeeyay W | 50/100/200 | 200/400 |
| Diyaaradda biyaha |
|
|
| Dhexroor sanka μm | 25-80 | 25-80 |
| Bar cadaadiska sanbabada | 100-600 | 0-600 |
| Cabbirka/Miisaanka |
|
|
| Cabirka (Mashiinka) (W x L x H) | 1050 x 800 x 1870 | 1200 x 1200 x 2000 |
| Cabbirrada (kabadhka xakamaynta) (W x L x H) | 700 x 2300 x 1600 | 700 x 2300 x 1600 |
| Miisaanka (qalabka) kg | 1170 | 2500-3000 |
| Miisaanka (xakamaynta golaha) kg | 700-750 | 700-750 |
| Isticmaalka tamarta dhamaystiran |
|
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| Input | AC 230 V + 6%/ -10%, mid jiho ah 50/60 Hz ± 1% | AC 400 V + 6%/-10%, 3-phase50/60 Hz ± 1% |
| Qiimaha ugu sarreeya | 2.5kVA | 2.5kVA |
| Jballi | 10m fiilo koronto: P+N+E, 1.5 mm2 | 10m fiilo koronto: P+N+E, 1.5 mm2 |
| Kala duwanaanshaha adeegsiga warshadaha semiconductor | ≤4 inch oo wareeg ah ≤4 inch oo jarjar goglan ≤4 inch ingot qorid
| ≤6 inch oo wareeg ah ≤6 ≤6 jeex ah oo la jarjaray ≤6 inch ingot wax qorid Mashiinku wuxuu la kulmaa 8-inji wareegtada / goynta / goynta qiimaha aragtida, iyo natiijooyinka la taaban karo ee gaarka ah waxay u baahan yihiin in la hagaajiyo istiraatiijiyada goynta |
