Doonta Wafer

Sharaxaad Gaaban:

Doomaha waferku waa qaybaha muhiimka ah ee habka wax soo saarka semiconductor. Semiera waxay awood u leedahay inay bixiso doomo wafer ah oo si gaar ah loogu talagalay loona soo saaray hababka fidinta, kuwaas oo door muhiim ah ka ciyaara soo saarista wareegyada isku dhafan ee sare. Waxaa naga go'an inaan ku bixino alaabooyinka tayada sare leh qiimo tartan leh waxaanan rajeyneynaa inaan noqono lammaanahaaga muddada-dheer ee Shiinaha.


Faahfaahinta Alaabta

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Faa'iidooyinka

Iska caabbinta oksaydhka heerkulka sare
Iska caabin daxalka oo heersare ah
Iska caabbinta abrasion wanaagsan
Isku-xidhka sare ee dhaqdhaqaaqa kulaylka
Nafta dufanka, cufnaanta hoose
adkaanta sare
Naqshad la habeeyey.

HGF (2)
HGF (1)

Codsiyada

-Goob u adkaysta: baadiyaha, saxan, biibiile ciid, dahaarka duufaanka, foosto shiidi, iwm.
Goobta Heerkulka Sare: SiC Slab, Quenching Furnace Tube, Tube Radiant, Crucible, Cunsurka Kuleyliyaha, Roller, Beam, Heat Beddelka, Dhuumaha Hawada Qabow, Nozzle Gubida, Tuubada Ilaalinta Heerarka, SiC Doonta, Qaabdhismeedka Gaariga, Setter, iwm.
-Silicon Carbide Semiconductor: SiC wafer boat, sic chuck, sic paddle, sic caseette, sic tube diffusion, fargeeto wafer, saxan nuugid, hage, iwm.
-Silicon Carbide Seal Field: dhammaan noocyada giraanta shaabadda, sida, baadiyaha, iwm.
Goobta Sawirka: Cantilever Paddle, Foosto wax shiida, Roller Silicon Carbide, iwm.
- Goobta baytariyada Lithium

WAFER (1)

WAFER (2)

Tilmaamaha Jirka ee SiC

Hanti Qiimaha Habka
Cufnaanta 3.21 g/cc Quus-sabeen iyo cabbir
Kuleyl gaar ah 0.66 J/g °K Fiishka laysarka la garaaco
Xoog dabacsanaan 450 MPa560 MPa 4-dhibcood laablaab, 1300 °
adkaanta jabka 2.94 MPa m1/2 Microindentation
Adag 2800 Vicker's, 500 g oo culeys ah
Modulus Elastic ModulusYoung's Modulus 450 GPa430 GPA 4 pt qaloocsan, RT4 pt laab, 1300 °C
Cabbirka hadhuudhka 2 - 10 µm SEM

Guryaha kulaylka ee SiC

Habdhaqanka kulaylka 250 W/m °K Habka Flash Laser, RT
Balaadhinta kulaylka (CTE) 4.5 x 10-6 °K Heerkulka qolka ilaa 950C, silica dilatometer

Qiyaasaha Farsamada

Shayga Unug Xogta
RBSiC(SiSiC) NBSiC SSiC RSiC OSiC
Nuxurka SiC % 85 75 99 99.9 ≥99
Waxa ku jira silikoon bilaash ah % 15 0 0 0 0
Heerkulka adeegga ugu sarreeya 1380 1450 1650 1620 1400
Cufnaanta g/cm3 3.02 2.75-2.85 3.08-3.16 2.65-2.75 2.75-2.85
Bannaanka furan % 0 13-15 0 15-18 7-8
Xoog laabashada 20℃ Мpa 250 160 380 100 /
Xoog laabashada 1200 ℃ Мpa 280 180 400 120 /
Modulus of elasticity 20℃ Gpa 330 580 420 240 /
Modulus of elasticity 1200 ℃ Gpa 300 / / 200 /
Heerarka kulaylka 1200 ℃ W/mK 45 19.6 100-120 36.6 /
Isku-dhafka ballaarinta kulaylka K-1X10-6 4.5 4.7 4.1 4.69 /
HV Kg/mm2 2115 / 2800 / /

Daahan CVD silicon carbide ee dusha sare ee alaabta dhoobada silikoon carbide recrystallized waxay gaari kartaa nadiif ah in ka badan 99.9999% si loo daboolo baahiyaha macaamiisha ee warshadaha semiconductor.

Goobta shaqada ee Semicera
Goobta shaqada ee Semicera 2
Mashiinka qalabka
Habaynta CNN, nadiifinta kiimikada, daahan CVD
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