3C-SiC Wafer Substrate

Sharaxaad Gaaban:

Substrates Semicera 3C-SiC Wafer Substrates waxay bixiyaan kuleyl sare oo koronto ah iyo koronto burbursan oo sarreeya, oo ku habboon aaladaha korantada ee korantada iyo kuwa sarreeya. Substrate-yadan waxaa loo habeeyay si sax ah oo loogu talagalay waxqabadka ugu wanaagsan ee deegaan qallafsan, iyaga oo hubinaya isku halaynta iyo hufnaanta. Dooro Semicera xalal cusub oo horumarsan.


Faahfaahinta Alaabta

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Semicera 3C-SiC Wafer Substrates waxaa loo habeeyey si ay u bixiyaan madal adag oo loogu talagalay korantada soo socota ee qalabka elektiroonigga ah iyo aaladaha soo noqnoqda. Iyada oo leh guryaha kuleylka sare iyo sifooyinka korantada, substrate-yadan waxaa loogu talagalay inay buuxiyaan shuruudaha baahida tignoolajiyada casriga ah.

Qaab dhismeedka 3C-SiC (Cubic Silicon Carbide) ee Semicera Wafer Substrates wuxuu bixiyaa faa'iidooyin gaar ah, oo ay ku jiraan kuleyliyaha sare ee kuleylka iyo kororka fidinta kulaylka hoose marka loo eego agabka kale ee semiconductor. Tani waxay ka dhigaysaa doorasho aad u wanaagsan aaladaha ku shaqeeya heerkul aad u daran iyo xaalado awood sare leh.

Iyada oo koronto jabaysa koronto sare iyo xasilooni kiimikaad sare leh, Semicera 3C-SiC Wafer Substrates waxay hubisaa waxqabadka muddada dheer iyo kalsoonida. Guryahaani waxay muhiim u yihiin codsiyada sida radar-soo noqnoqoshada sare, nalka adag ee gobolka, iyo rogayaasha tamarta, halkaas oo waxtarka iyo adkeysiga ay muhiim u yihiin.

Ka go'naanta Semicera ee tayada waxay ka muuqataa habka wax-soo-saarka ee 3C-SiC Wafer Substrates, hubinta isku-duubnida iyo joogtaynta dufc kasta. Saxnimadani waxay gacan ka geysataa guud ahaan waxqabadka iyo cimri dhererka aaladaha elegtarooniga ah ee lagu dhisay.

Adiga oo dooranaya Semicera 3C-SiC Wafer Substrates, soosaarayaashu waxay helayaan walax jeexan oo awood u siinaysa horumarinta qaybo elektiroonig ah oo yaryar, dhakhso badan, oo hufan. Semicera waxay sii wadaa inay taageerto hal-abuurnimada tignoolajiyada iyadoo bixisa xalal la isku halayn karo oo buuxinaya baahiyaha soo koraya ee warshadaha semiconductor.

Walxaha

Wax soo saar

Cilmi baaris

nacasnimo

Qiyaasta Crystal

Noocyo badan

4H

Khaladka jihaynta dusha sare

<11-20>4±0.15°

Qiyaasta Korontada

Dopant

n-nooca Nitrogen

iska caabin

0.015-0.025ohm · cm

Halbeegyada Makaanikada

Dhexroorka

150.0 ± 0.2mm

Dhumucda

350± 25 μm

Hanuuninta fidsan ee aasaasiga ah

[1-100]±5°

Dhererka siman ee aasaasiga ah

47.5 ± 1.5mm

Dabaqa labaad

Midna

TTV

≤5 μm

≤10 μm

≤15 μm

LTV

≤3 μm (5mm*5mm)

≤5 μm (5mm*5mm)

≤10 μm (5mm*5mm)

Qaansada

-15μm ~ 15μm

-35μm ~ 35μm

-45μm ~ 45μm

Warp

≤35 μm

≤45 μm

≤55 μm

Wajiga hore (Si-wejiga) qallafsanaanta (AFM)

Ra≤0.2nm (5μm*5μm)

Qaab dhismeedka

Cufnaanta tuubbada yar

<1 ea/cm2

<10 ea/cm2

<15 ea/cm2

Wasakhda birta

≤5E10atom/cm2

NA

BPD

≤1500 ea/cm2

≤3000 ea/cm2

NA

TSD

≤500 ea/cm2

≤1000 ea/cm2

NA

Tayada hore

Hore

Si

Dhammaadka dusha sare

Si-wejiga CMP

Qaybaha

≤60ea/wafer (xajmiga≥0.3μm)

NA

xoqid

≤5ea/mm Dhererka isugeynta ≤ Dhexroorka

Dhererka isugeynta≤2* Dhexroor

NA

Diirka liimiga ah/gomayska/ wasakhowga/ dildilaaca/ wasakhowga

Midna

NA

Chips-ka-geeska/indents/jabka/taargada hex

Midna

Aagagga nooca badan

Midna

Aagga isugeynta≤20%

Aagga isugeynta≤30%

Calaamadaynta laysarka hore

Midna

Tayada dambe

Dhammaadka dhabarka

C-waji CMP

xoqid

≤5ea/mm, Dhererka isugeynta≤2* Dhexroor

NA

Cilladaha dhabarka (dhab-jeexyada geesaha)

Midna

Dhabar xumada

Ra≤0.2nm (5μm*5μm)

Calaamadaynta laser-ka dambe

1 mm (laga bilaabo cidhifka sare)

Cidhif

Cidhif

Chamfer

Baakadaha

Baakadaha

Epi-diyaar ah oo leh baakad vacuum ah

Baakadaha cajaladaha wafer-ka badan

* Xusuusin: "NA" macnaheedu waa codsi la'aan Waxyaabaha aan la sheegin waxay tixraaci karaan SEMI-STD.

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SiC wafers

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